View SAA5361_292017.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
SAA5360; SAA5361 Multi page intelligent teletext decoder
Product specification Supersedes data of 2005 Jan 25 2005 Mar 09
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
CONTENTS 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 8 9 10 11 12 12.1 12.2 12.3 12.3.1 12.3.2 FEATURES GENERAL DESCRIPTION QUICK REFERENCE DATA ORDERING INFORMATION BLOCK DIAGRAM PINNING Type SAA5360 Type SAA5361 COMMANDS AND CHARACTER SETS High-level command interface Character sets LIMITING VALUES THERMAL CHARACTERISTICS QUALITY AND RELIABILITY CHARACTERISTICS APPLICATION INFORMATION EMC guidelines Application diagram Application notes External data memory access Symbol explanations 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 18
SAA5360; SAA5361
PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DATA SHEET STATUS DEFINITIONS DISCLAIMERS PURCHASE OF PHILIPS I2C COMPONENTS
2005 Mar 09
2
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
1 FEATURES
SAA5360; SAA5361
* Support for 50 or 60 and 100 or 120 Hz and progressive scan display modes * Complete 625 line teletext decoder in one chip reduces printed-circuit board area and cost * Automatic detection of transmitted fastext links or service information (packet 8/30) * On-Screen Display (OSD) for user interface menus using teletext and dedicated menu icons * Video Programming System (VPS) decoding * Wide Screen Signalling (WSS) decoding * SAA5360 supports Pan-European, Arabic and Iranian character sets * SAA5361 supports Pan-European, Cyrillic, Greek and Arabic character sets * High-level command interface via I2C-bus gives easy control with a low software overhead * High-level command interface is backward compatible to Stand-Alone Fastext And Remote Interface (SAFARI) * 625 and 525 line display * RGB interface to standard colour decoder ICs; current source * Versatile 8-bit open-drain Input/Output (I/O) expander; 5 V tolerant * Single 12 MHz crystal oscillator * Single power supply: from 3.0 V to 3.6 V * Operating temperature: -20 to +70 C 3 QUICK REFERENCE DATA SYMBOL VDD IDDP IDDC IDDA fxtal(nom) Tamb Tstg Note 1. Periphery supply current is dependent on external components and I/O voltage levels. PARAMETER all supply voltages periphery supply current core supply current analog supply current nominal crystal frequency ambient temperature storage temperature CONDITIONS referenced to VSS note 1 normal mode idle mode normal mode idle mode fundamental mode MIN. 3.0 1 - - - - - -20 -55 TYP. 3.3 - 15 4.6 45 0.87 12 - - MAX. 3.6 - 18 6 48 1 - +70 +125 UNIT V mA mA mA mA mA MHz C C * Automatic detection of transmitted pages to be selected by page up and page down * 8 page fastext decoder * Table Of Pages (TOP) decoder with Basic Top Table (BTT) and Additional Information Tables (AITs) * 4 page user-defined list mode. 2 GENERAL DESCRIPTION
The SAA5360; SAA5361 is a single-chip multi page 625 line world system teletext decoder with a high-level command interface, and is SAFARI compatible. The device is designed to minimize the overall system cost, due to the high-level command interface offering the benefit of a low software overhead in the TV microcontroller. The SAA5360 incorporates the following functions: * 10 page teletext decoder with OSD, fastext, TOP, default and list acquisition modes * Automatic channel installation support. The functionality of the SAA5361 is similar to the SAA5360, but offers the capability to store up to 250 additional pages of teletext in an external SRAM.
2005 Mar 09
3
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
4 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME SAA5360HL SAA5361HL 5 DESCRIPTION
SAA5360; SAA5361
VERSION SOT407-1 SOT407-1
LQFP100 plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm LQFP100 plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
BLOCK DIAGRAM
I2C-bus, general I/O
TV CONTROL AND INTERFACE
ROM (128 or 192-kbyte)
MICROCONTROLLER (80C51)
SRAM 256-byte
DRAM (14-kbyte)
MEMORY INTERFACE
SAA5360 SAA5361
R CVBS DATA CAPTURE DISPLAY G B VDS
CVBS
DATA CAPTURE TIMING
DISPLAY TIMING
HSYNC VSYNC
mhc633
Fig.1 Block diagram.
2005 Mar 09
4
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
6 6.1 PINNING Type SAA5360 SYMBOL P2_7/PWM6 P3_0/ADC0 n.c. P3_1/ADC1 P3_2/ADC2 P3_3/ADC3 n.c. n.c. n.c. n.c. VSSC VSSP P0_5 n.c. n.c. SCL_NVRAM SDA_NVRAM P0_2 n.c. n.c. VPE P0_3 n.c. P0_4 n.c. n.c. n.c. P0_6 P0_7 VSSA CVBS0 CVBS1 n.c. SYNC_FILTER IREF PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 TYPE I/O I/O - I/O I/O I/O - - - - - - I/O - - I I/O I/O - - I I/O - I/O - - - I/O I/O - I I - I/O I DESCRIPTION
SAA5360; SAA5361
programmable bidirectional port 2: bit 7 or output bit 6 of the 7-bit PWM programmable bidirectional port 3: bit 0 or input 0 for the software ADC facility not connected programmable bidirectional port 3: bit 1 or input 1 for the software ADC facility programmable bidirectional port 3: bit 2 or input 2 for the software ADC facility programmable bidirectional port 3: bit 3 or input 3 for the software ADC facility not connected not connected not connected not connected core ground periphery ground 8 mA current sinking output for direct drive of LED not connected not connected I2C-bus serial clock input to non-volatile RAM I2C-bus serial data input and output of non-volatile RAM programmable bidirectional port 0: bit 2 not connected not connected OTP programming voltage input; connect to ground programmable bidirectional port 0: bit 3 not connected programmable bidirectional port 0: bit 4 not connected not connected not connected 8 mA current sinking output for direct drive of LED programmable bidirectional port 0: bit 7 analog ground composite video input 0 selectable via SFR; a positive-going 1 V (p-p) input is required and connected via a 100 nF capacitor composite video input 1 selectable via SFR; a positive-going 1 V (p-p) input is required and connected via a 100 nF capacitor not connected CVBS sync filter input; this pin should be connected to VSSA via a 100 nF capacitor reference current input for analog circuits and connected to VSSA via a 24 k resistor
2005 Mar 09
5
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
SYMBOL n.c. n.c. n.c. n.c. n.c. FRAME VPE COR n.c. VDDA B G R n.c. n.c. n.c. VDS HSYNC n.c. VSYNC n.c. n.c. n.c. n.c. VSSP n.c. VSSC VDDC n.c. n.c. n.c. n.c. n.c. OSCGND XTALIN XTALOUT RESET
PIN 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72
TYPE - - - - - O I O - - O O O - - - O I - I - - - - - - - - - - - - - - I O I not connected not connected not connected not connected not connected
DESCRIPTION
de-interlace output synchronized with the VSYNC pulse to produce a non-interlaced display by adjustment of the vertical deflection circuits OTP programming voltage input; connect to ground output which allows selective contrast reduction of the TV picture to enhance a mixed mode display; open-drain; active LOW not connected 3.3 V analog supply voltage pixel rate output of the blue colour information pixel rate output of the green colour information pixel rate output of the red colour information not connected not connected not connected video or data switch push-pull output for dot rate fast blanking Schmitt-triggered input for a TTL-level version of the horizontal sync pulse; the polarity of this pulse is programmable by register bit TXT1.H POLARITY not connected Schmitt-triggered input for a TTL-level version of the vertical sync pulse; the polarity of this pulse is programmable by register bit TXT1.V POLARITY not connected not connected not connected not connected periphery ground not connected core ground 3.3 V core supply voltage not connected not connected not connected not connected not connected crystal oscillator ground 12 MHz crystal oscillator input 12 MHz crystal oscillator output reset input; if LOW for at least 24 crystal oscillator periods while the oscillator is running, the device is reset; internal pull-up 6
2005 Mar 09
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
SYMBOL RESET
PIN 73
TYPE I
DESCRIPTION reset input; if HIGH for at least 24 crystal oscillator periods while the oscillator is running, the device is reset; this pin should be connected to VDDC via a capacitor if an active HIGH reset is required; internal pull-down not connected 3.3 V periphery supply voltage programmable bidirectional port 1: bit 0 not connected programmable bidirectional port 1: bit 1 programmable bidirectional port 1: bit 2 programmable bidirectional port 1: bit 3 I2C-bus serial clock input from application I2C-bus serial data input from or output to application programmable bidirectional port 1: bit 4 programmable bidirectional port 1: bit 5 not connected not connected not connected not connected not connected not connected not connected not connected programmable bidirectional port 2: bit 1 or output bit 0 of the 7-bit PWM programmable bidirectional port 2: bit 2 or output bit 1 of the 7-bit PWM programmable bidirectional port 2: bit 3 or output bit 2 of the 7-bit PWM programmable bidirectional port 2: bit 4 or output bit 3 of the 7-bit PWM programmable bidirectional port 2: bit 5 or output bit 4 of the 7-bit PWM programmable bidirectional port 2: bit 6 or output bit 5 of the 7-bit PWM core ground programmable bidirectional port 2: bit 0 or output for 14-bit high precision PWM
n.c. VDDP P1_0 n.c. P1_1 P1_2 P1_3 SCL SDA P1_4 P1_5 n.c. n.c. n.c. n.c. n.c. n.c. n.c. n.c. P2_1/PWM0 P2_2/PWM1 P2_3/PWM2 P2_4/PWM3 P2_5/PWM4 P2_6/PWM5 VSSC P2_0/TPWM
74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
- - I/O - I/O I/O I/O I I/O I/O I/O - - - - - - - - I/O I/O I/O I/O I/O I/O - I/O
2005 Mar 09
7
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
100 P2_0/TPWM
98 P2_6/PWM5
97 P2_5/PWM4
96 P2_4/PWM3
95 P2_3/PWM2
94 P2_2/PWM1
93 P2_1/PWM0
99 VSSC
84 P1_5
83 P1_4
80 P1_3
79 P1_2
78 P1_1
76 P1_0
82 SDA
81 SCL
92 n.c.
91 n.c.
90 n.c.
89 n.c.
88 n.c.
87 n.c.
86 n.c.
85 n.c.
77 n.c.
P2_7/PWM6 P3_0/ADC0 n.c. P3_1/ADC1 P3_2/ADC2 P3_3/ADC3 n.c. n.c. n.c.
1 2 3 4 5 6 7 8 9
75 VDDP 74 n.c. 73 RESET 72 RESET 71 XTALOUT 70 XTALIN 69 OSCGND 68 n.c. 67 n.c. 66 n.c. 65 n.c. 64 n.c.
n.c. 10 VSSC 11 VSSP 12 P0_5 13 n.c. 14 n.c. 15 SCL_NVRAM 16 SDA_NVRAM 17 P0_2 18 n.c. 19 n.c. 20 VPE 21 P0_3 22 n.c. 23 P0_4 24 n.c. 25
SAA5360HL
63 VDDC 62 VSSC 61 n.c. 60 VSSP 59 n.c. 58 n.c. 57 n.c. 56 n.c. 55 VSYNC 54 n.c. 53 HSYNC 52
VDS
51 n.c.
n.c. 26
n.c. 27
P0_6 28
P0_7 29
VSSA 30
CVBS0 31
CVBS1 32
n.c. 33
SYNC_FILTER 34
IREF 35
n.c. 36
n.c. 37
n.c. 38
n.c. 39
n.c. 40
FRAME 41
VPE 42
COR 43
n.c. 44
VDDA 45
B 46
G 47
R 48
n.c. 49
n.c. 50
mhc508
Fig.2 Pin configuration of SAA5360HL.
2005 Mar 09
8
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
6.2 Type SAA5361 SYMBOL P2_7/PWM6 P3_0/ADC0 n.c. P3_1/ADC1 P3_2/ADC2 P3_3/ADC3 n.c. A14 RD WR VSSC VSSP P0_5 n.c. A7 SCL_NVRAM SDA_NVRAM P0_2 n.c. n.c. VPE P0_3 A6 P0_4 n.c. A5 A4 P0_6 P0_7 VSSA CVBS0 CVBS1 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 TYPE I/O I/O O I/O I/O I/O O O O O I/O I O I I/O I/O O O I I/O O I/O I/O O O I/O I/O I I DESCRIPTION
SAA5360; SAA5361
programmable bidirectional port 2: bit 7 or output bit 6 of the 6-bit PWM programmable bidirectional port 3 with alternative functions: bit 0 or input 0 for the software ADC facility not connected programmable bidirectional port 3 with alternative functions: bit 1 or input 1 for the software ADC facility programmable bidirectional port 3 with alternative functions: bit 2 or input 2 for the software ADC facility programmable bidirectional port 3 with alternative functions: bit 3 or input 3 for the software ADC facility not connected address line 14 read control output to external data memory; active LOW write control output to external data memory; active LOW core ground periphery ground 8 mA current sinking output for direct drive of LED not connected address line 7 I2C-bus serial clock input to non-volatile RAM I2C-bus serial data input and output of non-volatile RAM programmable bidirectional port 0 with alternative functions: bit 2 input and output for general use not connected not connected OTP programming voltage input; connect to ground programmable bidirectional port 0 with alternative functions: bit 3 input and output for general use address line 6 programmable bidirectional port 0 with alternative functions: bit 4 input and output for general use not connected address line 5 address line 4 8 mA current sinking output for direct drive of LED programmable bidirectional port 0 with alternative functions: bit 7 input and output for general use analog ground composite video input 0 selectable via SFR; a positive-going 1 V (p-p) input is required and connected via a 100 nF capacitor composite video input 1 selectable via SFR; a positive-going 1 V (p-p) input is required and connected via a 100 nF capacitor 9
2005 Mar 09
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
SYMBOL A15_BK SYNC_FILTER IREF A13 A12 A3 A2 A1 FRAME VPE COR n.c. VDDA B G R A0 RAMBK1 RAMBK0 VDS HSYNC n.c. VSYNC n.c. n.c. n.c. n.c. VSSP n.c. VSSC VDDC A11 A10 A9 A8 n.c. OSCGND 2005 Mar 09
PIN 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69
TYPE O I/O I O O O O O O I O I/O O O O O O O O I I/O I O O O I/O I O O O O O address line 15
DESCRIPTION CVBS sync filter input; this pin should be connected to VSSA via a 100 nF capacitor reference current input for analog circuits and connected to VSSA via a 24 k resistor address line 13 address line 12 address line 3 address line 2 address line 1 de-interlace output synchronized with the VSYNC pulse to produce a non-interlaced display by adjustment of the vertical deflection circuits OTP programming voltage input; connect to ground output which allows selective contrast reduction of the TV picture to enhance a mixed mode display; open-drain; active LOW not connected 3.3 V analog supply voltage pixel rate output of the blue colour information pixel rate output of the green colour information pixel rate output of the red colour information address line 0 RAMBK SFR selection bits input 1 for external program SRAM data storage RAMBK SFR selection bits input 0 for external program SRAM data storage video or data switch push-pull output for dot rate fast blanking Schmitt-triggered input for a TTL-level version of the horizontal sync pulse; the polarity of this pulse is programmable by register bit TXT1.H POLARITY not connected Schmitt-triggered input for a TTL-level version of the vertical sync pulse; the polarity of this pulse is programmable by register bit TXT1.V POLARITY not connected not connected not connected not connected periphery ground not connected (internal pull-up) core ground 3.3 V core supply voltage address line 11 address line 10 address line 9 address line 8 not connected crystal oscillator ground 10
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
SYMBOL XTALIN XTALOUT RESET RESET
PIN 70 71 72 73
TYPE I O I I 12 MHz crystal oscillator input 12 MHz crystal oscillator output
DESCRIPTION
reset input; if LOW for at least 24 crystal oscillator periods while the oscillator is running, the device is reset; internal pull-up reset input; if HIGH for at least 24 crystal oscillator periods while the oscillator is running, the device is reset; this pin should be connected to VDDC via a capacitor if an active HIGH reset is required; internal pull-down not connected 3.3 V periphery supply voltage programmable bidirectional port 1 with alternative functions: bit 0 input and output for general use not connected programmable bidirectional port 1 with alternative functions: bit 1 input and output for general use programmable bidirectional port 1 with alternative functions: bit 2 input and output for general use programmable bidirectional port 1 with alternative functions: bit 3 input and output for general use I2C-bus serial clock input from application I2C-bus serial data input from or output to application programmable bidirectional port 1 with alternative functions: bit 4 input and output for general use programmable bidirectional port 1 with alternative functions: bit 5 input and output for general use address line 0 with multiplexed data line 0 address line 1 with multiplexed data line 1 address line 2 with multiplexed data line 2 address line 3 with multiplexed data line 3 address line 4 with multiplexed data line 4 address line 5 with multiplexed data line 5 address line 6 with multiplexed data line 6 address line 7 with multiplexed data line 7 programmable bidirectional port 2: bit 1 or output bit 0 of the 6-bit PWM programmable bidirectional port 2: bit 2 or output bit 1 of the 6-bit PWM programmable bidirectional port 2: bit 3 or output bit 2 of the 6-bit PWM programmable bidirectional port 2: bit 4 or output bit 3 of the 6-bit PWM programmable bidirectional port 2: bit 5 or output bit 4 of the 6-bit PWM programmable bidirectional port 2: bit 6 or output bit 5 of the 6-bit PWM core ground programmable bidirectional port 2: bit 0 or output for 14-bit high precision PWM
n.c. VDDP P1_0 n.c. P1_1 P1_2 P1_3 SCL SDA P1_4 P1_5 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 P2_1/PWM0 P2_2/PWM1 P2_3/PWM2 P2_4/PWM3 P2_5/PWM4 P2_6/PWM5 VSSC P2_0/TPWM
74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
O IO O I/O I/O I/O I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O
2005 Mar 09
11
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
100 P2_0/TPWM
98 P2_6/PWM5
97 P2_5/PWM4
96 P2_4/PWM3
95 P2_3/PWM2
94 P2_2/PWM1
93 P2_1/PWM0
99 VSSC
84 P1_5
83 P1_4
80 P1_3
79 P1_2
78 P1_1
76 P1_0
82 SDA
92 AD7
91 AD6
90 AD5
89 AD4
88 AD3
87 AD2
86 AD1
85 AD0
81 SCL
77 n.c.
P2_7/PWM6 P3_0/ADC0 n.c. P3_1/ADC1 P3_2/ADC2 P3_3/ADC3 n.c. A14 RD
1 2 3 4 5 6 7 8 9
75 VDDP 74 n.c. 73 RESET 72 RESET 71 XTALOUT 70 XTALIN 69 OSCGND 68 n.c. 67 A8 66 A9 65 A10 64 A11
WR 10 VSSC 11 VSSP 12 P0_5 13 n.c. 14 A7 15 SCL_NVRAM 16 SDA_NVRAM 17 P0_2 18 n.c. 19 n.c. 20 VPE 21 P0_3 22 A6 23 P0_4 24 n.c. 25
SAA5361HL
63 VDDC 62 VSSC 61 n.c. 60 VSSP 59 n.c. 58 n.c. 57 n.c. 56 n.c. 55 VSYNC 54 n.c. 53 HSYNC 52 VDS 51 RAMBK0
A5 26
A4 27
P0_6 28
P0_7 29
VSSA 30
CVBS0 31
CVBS1 32
A15_BK 33
SYNC_FILTER 34
IREF 35
A13 36
A12 37
A3 38
A2 39
A1 40
FRAME 41
VPE 42
COR 43
n.c. 44
VDDA 45
B 46
G 47
R 48
A0 49
RAMBK1 50
001aaa526
Fig.3 Pin configuration of SAA5361HL.
2005 Mar 09
12
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
7 7.1 COMMANDS AND CHARACTER SETS High-level command interface
SAA5360; SAA5361
The I2C-bus interface is used to pass control commands and data between the SAA5360; SAA5361 and the television microcontroller. The interface uses high-level commands, which are backwards compatible with the SAFARI. The I2C-bus transmission formats are given in Tables 1 to 3. Table 1 User command USER COMMAND START Table 2 I2C-bus address System command SYSTEM COMMAND START Table 3 I2C-bus address User read USER READ START 7.2 I2C-bus address read ACK data ACK STOP write ACK command ACK parameter ACK STOP write ACK command ACK STOP
Character sets
The SAA5360HL/M1/0004 contains the character set for Pan-Euro, Arabic and Iranian and has slave address 58H. The SAA5361HL/M1/1651 contains the character set for Pan-Euro, Cyrillic, Greek and Arabic and has slave address 60H.
2005 Mar 09
13
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
8 LIMITING VALUES In accordance with Absolute Maximum Rating System (IEC 60134). SYMBOL VDD VI VO IO IIO(d) Tamb Tj Tstg Vesd PARAMETER all supply voltages input voltage (any input) output voltage (any output) output current (each output) diode DC input or output current ambient temperature junction temperature storage temperature electrostatic discharge voltage Human body model; C = 100 pF; R = 1.5 k Machine model; C = 200 pF; R = 0 Ilu Note latch-up current 1.5 x VDD VDD < 3.6 V; note 1 VDD 3.6 V; note 1 note 1 CONDITIONS
SAA5360; SAA5361
MIN. -0.5 -0.5 -0.5 -0.5 - - -20 -20 -55 - - -
MAX. +4.0 VDD + 0.5 4.1 VDD + 0.5 10 20 +70 +125 +125 2000 200 100 V V V V mA mA C C C V V mA
UNIT
1. This maximum value refers to 5 V tolerant I/Os and may be 6 V maximum but only when VDD is present. 9 THERMAL CHARACTERISTICS PARAMETER thermal resistance from junction to ambient thermal resistance from junction to case CONDITIONS in free air VALUE 52 8 UNIT K/W K/W
SYMBOL Rth(j-a) Rth(j-c)
10 QUALITY AND RELIABILITY In accordance with "General Quality Specification for Integrated circuits SNW-FQ-611".
2005 Mar 09
14
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
11 CHARACTERISTICS VDD = 3.3 V 10 %; VSS = 0 V; Tamb = -20 C to +70 C; unless otherwise specified. SYMBOL Supplies VDD IDDP IDDC any supply voltage periphery supply current core supply current referenced to VSS note 1 operating mode idle mode power-down mode IDDA analog supply current operating mode idle mode power-down mode Digital inputs PIN RESET VIL VIH Vhys ILI Rpd PIN RESET VIL VIH Vhys ILI Rpu VIL VIH Vhys ILI LOW-level input voltage HIGH-level input voltage hysteresis voltage of Schmitt-trigger input input leakage current equivalent pull-up resistance VI = VDD VI = 0 - LOW-level input voltage HIGH-level input voltage hysteresis voltage of Schmitt-trigger input input leakage current equivalent pull-down resistance VI = 0 VI = VDD - 3.0 1 - - - - - - PARAMETER CONDITIONS
SAA5360; SAA5361
MIN.
TYP.
MAX.
UNIT
3.3 - 15 4.6 0.76 45 0.87 0.45
3.6 - 18 6 1 48 1 0.7
V mA mA mA mA mA mA mA
- - - -
1.00 5.5 0.58 0.17 92.45
V V V A k
1.85 0.44 -
55.73 70.71 - - - -
0.98 5.5 0.5 0.00 70.01
V V V A k
1.73 0.41 -
46.07 55.94 - 1.80 0.40 - - - -
PINS HSYNC AND VSYNC LOW-level input voltage HIGH-level input voltage hysteresis of Schmitt-trigger input input leakage current VI = 0 to VDD 0.96 5.5 0.56 0.00 V V V A
-
Digital outputs PINS FRAME AND VDS VOL VOH to(r) to(f) LOW-level output voltage HIGH-level output voltage output rise time output fall time IOL = 3 mA IOH = 3 mA 10 % to 90 % of VDD; CL = 70 pF 10 % to 90 % of VDD; CL = 70 pF - 2.84 7.50 6.70 - - 8.85 7.97 0.13 - 10.90 10.00 V V ns ns
2005 Mar 09
15
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
SYMBOL PIN COR (OPEN-DRAIN) VOL VOH ILI to(r) to(f)
PARAMETER
CONDITIONS
MIN. - 2.84 - 7.20 4.90
TYP. - - - 8.64 7.34
MAX.
UNIT
LOW-level output voltage HIGH-level pull-up output voltage input leakage current output rise time output fall time
IOL = 3 mA IOL = -3 mA; push-pull VI = 0 to VDD 10 % to 90 % of VDD; CL = 70 pF 10 % to 90 % of VDD; CL = 70 pF
0.14 - 0.12 11.10 9.40
V V A ns ns
Digital input/outputs PINS SCL_NVRAM, SDA_NVRAM, P0_4 TO P0_7, P1_0, P1_1, P2_1 TO P2_7 AND P3_0 TO P3_4 VIL VIH Vhys ILI VOL VOH to(r) to(f) LOW-level input voltage HIGH-level input voltage hysteresis of Schmitt-trigger input input leakage current LOW-level output voltage HIGH-level output voltage output rise time output fall time VI = 0 to VDD IOL = 4 mA IOH = -4 mA; push-pull 10 % to 90 % of VDD; CL = 70 pF; push-pull 10 % to 90 % of VDD; CL = 70 pF - 1.78 0.41 - - 2.81 6.50 5.70 - - - - - - 8.47 7.56 0.98 5.50 0.55 0.01 0.18 - 10.70 10.00 V V V A V V ns ns
PINS P1_2, P1_3 AND P2_0 VIL VIH Vhys ILI VOL VOH to(r) to(f) LOW-level input voltage HIGH-level input voltage hysteresis voltage of Schmitt-trigger input input leakage current LOW-level output voltage HIGH-level output voltage output rise time output fall time VI = 0 to VDD IOL = 4 mA IOH = -4 mA; push-pull 10 % to 90 % of VDD; CL = 70 pF; push-pull 10 % to 90 % of VDD; CL = 70 pF - 1.80 0.42 - - 2.81 7.00 5.40 - - - - - - 8.47 7.36 0.99 5.50 0.56 0.02 0.17 - 10.50 9.30 V V V A V V ns ns
PINS P0_5 AND P0_6 VIL VIH ILI Vhys VOL VOH to(r) LOW-level input voltage HIGH-level input voltage input leakage current hysteresis voltage of Schmitt-trigger input LOW-level output voltage HIGH-level output voltage output rise time IOL = 8 mA IOH = -8 mA; push-pull 10 % to 90 % of VDD; CL = 70 pF; push-pull VI = 0 to VDD - 1.82 - 0.42 - 2.76 7.40 - - - - - - 8.22 0.98 5.50 0.11 0.58 0.20 - 8.80 V V A V V V ns
2005 Mar 09
16
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
SYMBOL to(f)
PARAMETER output fall time
CONDITIONS 10 % to 90 % of VDD; CL = 70 pF
MIN. 4.20
TYP. 4.57
MAX. 5.20
UNIT ns
PINS P1_4 AND P1_5 (OPEN DRAIN) VIL VIH Vhys ILI VOL to(f) to(f)(I2C) LOW-level input voltage HIGH-level input voltage hysteresis voltage of Schmitt-trigger input input leakage current LOW-level output voltage output fall time output fall time in relation to the I2C-bus specifications VI = 0 to VDD IOL = 8 mA 10 % to 90 % of VDD; CL = 70 pF - 1.99 0.49 - - - - - - - 1.08 5.50 0.60 0.13 0.35 103.30 - V V V A V ns ns
69.70 83.67 57.80
Vo = 3 V to 1.5 V at - IOL = 3 mA; CL = 400 nF
Analog inputs PINS CVBS0 AND CVBS1 Vsync Vv(p-p) Zsource VIH Ci PIN IREF Rgnd VIH Ci resistance to ground resistor tolerance 2 % range = VDDP - VTN; note 2 - - - 24 - - - VDDA 10 k sync voltage amplitude video input voltage amplitude (peak-to-peak value) source impedance HIGH-level input voltage input capacitance 0.1 0.7 0 3.0 - 0.3 1.0 - - - 0.6 1.4 250 VDDA + 0.3 10 V V V pF
PINS ADC0 TO ADC3 HIGH-level input voltage input capacitance V pF
Analog outputs PINS R, G AND B Io(b) Io(max) Io(70) RL CL to(r) to(f) output current (black level) output current (maximum Intensity) output current (70 % of full intensity) load resistor load capacitance output rise time output fall time 10 % to 90 % full intensity 90 % to 10 % full intensity VDDA = 3.3 V VDDA = 3.3 V; intensity level code = 31 decimal VDDA = 3.3 V; intensity level code = 0 decimal referenced to VSSA; resistor tolerance 5 % -10 6.0 4.2 - - - - - 6.67 4.7 150 - 16.1 14.5 +10 7.3 5.1 - 15 - - A mA mA pF ns ns
2005 Mar 09
17
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
SYMBOL Analog input/output PIN SYNC_FILTER Csync Vsync
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
storage capacitor to ground sync filter level voltage for nominal sync amplitude
- 0.35
100 0.55
- 0.75
nF V
Crystal oscillator INPUT: PIN XTALIN VIL VIH Ci Co fxtal CL Cmot Rres Cosc CO Txtal Xj Xd LOW-level input voltage HIGH-level input voltage input capacitance VSSA - - - fundamental mode Tamb = 25 C Tamb = 25 C Tamb = 25 C Tamb = 25 C - - - - - - -20 - - - - - - 12 - - - - VDDA 10 V V pF
OUTPUT: PIN XTALOUT output capacitance 10 - 30 20 60 pF
Crystal specification; notes 3 and 4 nominal frequency load capacitance motional capacitance resonance resistance crystal holder capacitance crystal temperature range adjustment tolerance drift MHz pF fF pF pF C 10-6
capacitors at pins XTALIN and XTALOUT Tamb = 25 C
note 4 - note 4 - +25 - - - - - - - - - - - - - - +85 50 x 100 x 10-6
I2C-bus characteristics for fast mode fSCL tBUF tHD;STA tLOW tHIGH tSU;STA tHD;DAT tSU;DAT tr tf tSU;STO Cb SCL clock frequency bus free time between a STOP and START condition hold time START condition; after this period; the first clock pulse is generated SCL LOW time SCL HIGH time set-up time repeated START data hold time data set-up time rise time SDA and SCL fall time SDA and SCL set-up time STOP condition capacitive load of each bus line note 8 notes 5 and 6 note 7 note 7 note 7 0 1.3 0.6 1.3 0.6 0.6 0 100 20 20 0.6 - 400 - - - - - 0.9 - 300 300 - 400 kHz s s s s s s ns ns ns s pF
2005 Mar 09
18
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
Notes
SAA5360; SAA5361
1. Periphery current is dependent on external components and voltage levels on I/Os. 2. VTN is the drop across a protection transistor which clamps the input to VDD. The maximum value is VTN = 0.75 V 3. Crystal order number 4322 143 05561. 4. If the 4322 143 05561 crystal is not used, the formula in the crystal specification should be used. The mean of the capacitances due to the chip at XTALIN and at XTALOUT is CIO, where CIO = 7 pF. Cext is a value for the mean of the stray capacitances due to the external circuits at XTALIN and XTALOUT. a) Cosc(typ) = 2CL - CIO - Cext. Capacitor Cosc may need to be reduced from the initial selected value. b) CO(max) = 35 - 0.5 (Cosc + CIO + Cext) pF. The maximum value for the crystal holder capacitance is to ensure start-up. 5. A device must internally provide a hold time of at least 300 ns for the SDA signal, referenced to the VIH(min) of the SCL signal, in order to bridge the undefined region of the falling edge of SCL. 6. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period of the SCL signal (tLOW(SCL)). 7. A fast mode I2C-bus device can be used in a standard-mode I2C-bus system, but the requirement tSU;DAT 250 ns must be met. This requirement is met for a device that does not stretch tLOW(SCL). If a device does stretch tLOW(SCL), the next data bit to the SDA line must be output tr(max) + tSU;DAT = 1000 + 250 = 1250 ns before the SCL line is released (according to the standard-mode I2C-bus specification). 8. Cb = total capacitance of one bus line in pF. 12 APPLICATION INFORMATION 12.1 EMC guidelines Using a device socket would increase the area and therefore increase the inductance of the external bypass loop. To provide a high-impedance to any high frequency signals on the VDD supplies to the IC, a ferrite bead or inductor can be connected in series with the supply line close to the decoupling capacitor. To prevent signal radiation, pull-up resistors of signal outputs should not be connected to the VDD supply on the IC side of the ferrite bead or inductor. OSCGND should only be connected to the crystal load capacitors and not to any other ground connection. Distances to physical connections of associated active devices should be as short as possible. PCB output tracks should have close proximity, mutually coupled and ground return paths.
Optimization of circuit return paths and minimization of common mode emission is achieved by a double sided Printed-Circuit Board (PCB) with low inductance ground plane. On a single-sided PCB a local ground plane under the whole IC should be present. Preferably, the PCB local ground plane connection should not be connected to other grounds on route to the PCB ground. Do not use wire links. Wire links cause ground inductance which increases ground bounce. The supply pins can be decoupled at the ground pin plane below the IC. This is easily achieved by using surface mount capacitors, which, at high frequency, are more effective than components with leads.
2005 Mar 09
19
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 2005 Mar 09 20 12.2 Philips Semiconductors
Multi page intelligent teletext decoder
40 V
VDD VDD 47 F VSS VSS VSS P2_0/TPWM VDD 100 nF VSS
Vtune
PH2369
Bidirectional ports have been configured as open-drain. Output ports have been configured as push-pull. Connections of the SAA5361HL to the external SDRAM are shown in Fig.5.
Application diagram
VDD
VDD
100 93 94 95 96 97 98 1 2 4 5 6 11, 62, 99 16 17 18 22 24 13 28 29 30
84 83 82 81 80 79 78 76 75 73 71 70
P1_5 P1_4 SDA SCL P1_3 P1_2 P1_1 P1_0 VDDP RESET XTALOUT XTALIN OSCGND VDDC VSSP VSYNC HSYNC VDS R G B VSS field flyback line flyback VDD 12 MHz 56 pF VDD 10 F VDD IR RECEIVER TV control signals
brightness contrast saturation hue volume (L) volume (R) VSS VAFC AV status
P2_1/PWM0 P2_2/PWM1 P2_3/PWM2 P2_4/PWM3 P2_5/PWM4 P2_6/PWM5 P2_7/PWM6 P3_0/ADC0 P3_1/ADC1 P3_2/ADC2 P3_3/ADC3
program + VSS program-
VSSC SCL_NVRAM SDA_NVRAM P0_2
SAA5360HL SAA5361HL
69 63 12, 60 55 53 52 48 47 46 45 44 43 21, 42 41
menu P0_3 P0_4 minus(-) P0_5 plus(+) VSS VDD 1 k 1 k VSSA VSS CVBS (IF) 100 nF CVBS (SCART) 100 nF CVBS0 CVBS1 SYNC_FILTER IREF 100 nF 24 k P0_6 P0_7
SAA5360; SAA5361
VDDA
31 32 34 35
VDD
150 VDD
to TV display circuits
COR VPE FRAME VSS VDD
VSS
Product specification
72
RESET
VSS
VDD
mhc509
Fig.4 Application diagram.
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 76 77 78 79 80 81 82 83 84 85 86 87 SAA5361HL 88 89 90 91 92 93 94 95 96 97 98 99 100 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 A7 A14 RD WR A6 RAMBK1 50 A0 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7
RAMBK0 A1 A2 A3 A12 A13 A15_BK A4 A5
OE RD/WR
D7 D6 D5 D4 D3 D2 D1 D0
SRAM
A8 A9 A10 A11 A17 A16 A15 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
coa003
Fig.5 Application diagram of SAA5361 with external SRAM connections.
2005 Mar 09
21
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
12.3 Application notes 12.3.2
SAA5360; SAA5361
SYMBOL EXPLANATIONS
Ports AD0 to AD7 of the microcontroller can be connected to pins D0 to D7 of the SRAM in any order. For the addressing, the lower group of address lines (A0 to A8) and the upper group of address lines (A9 to A14, A15_BK, RAMBK0 and RAMBK1) may be connected in any order within the groups, provided that the full 256 kbytes of external SRAM is used. Fig.5 shows the application diagram of the SAA5361 with external SRAM connections. When using an external SRAM smaller than 256 kbytes, the relevant number of bits from the microcontroller address bus should be disconnected, always removing the most significant bits first. For power saving modes, it might be advisable to control the CE pin of the SRAM module(s) using one of the microcontroller ports to de-select the SRAM. 12.3.1 Table 4 EXTERNAL DATA MEMORY ACCESS External data memory access (see Fig.6 and Fig.7) PARAMETER RD pulse width WR pulse width Data hold after RD Data float after RD ALE LOW to RD or WR LOW Address valid to WR LOW or RD LOW Data valid to WR LOW Data hold after WR RD LOW to address float RD or WR HIGH to ALE HIGH TYPICAL(1) UNIT 250 250 0 tbd 132 172 89 15 tbd 40 ns ns ns ns ns ns ns ns ns ns ns
Each timing symbol has five characters. The first character is always `t' (time). Depending on their positions, the other characters indicate the name of a signal or the logical status of that signal. The designations are: A = Address C = Clock D = Input data H = Logic level HIGH I = Instruction (program memory contents) L = Logic level LOW, or ALE P = PSEN Q = Output data R = RD signal t = Time V = Valid W = WR signal X = No longer a valid logic level Z = Float Examples: tAVLL = time for address valid to ALE LOW. tLLPL = time for ALE to PSEN LOW.
SYMBOL tRLRH tWLWH tRLDV tRHDX tRHDZ tLLWL tAVWL tQVWX tWHQX tRLAZ tWHLH Note
RD LOW to valid data in 198
1. The timings are only valid for the nominal 12 MHz clock provided to the microcontroller.
2005 Mar 09
22
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
SAA5360; SAA5361
handbook, full pagewidth
ALE t WHLH PSEN t LLWL RD t LLAX tAVLL AD<0:7> A0-A7 tAVWL A<0:14>, A15_BK, RAMBK<0:1>
GSA082
t RLRH
t RLDV t RLAZ t RHDX DATA IN
t RHDZ
A0-A7
INSTR IN
Fig.6 External data memory read cycle.
handbook, full pagewidth
ALE t WHLH PSEN t LLWL WR t LLAX tAVLL AD<0:7> A0-A7 tAVWL A<0:14>, A15_BK, RAMBK<0:1>
GSA083
t WLWH
t QVWX DATA OUT
t WHQX A0-A7 FROM PCL INSTR IN
Fig.7 External data memory write cycle.
2005 Mar 09
23
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
13 PACKAGE OUTLINE
SAA5360; SAA5361
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
c
y X 75 76 51 50 ZE A
e E HE wM bp pin 1 index 100 1 ZD bp D HD wM B vM B 25 vM A 26 detail X L Lp A A2 (A 3)
A1
e
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.15 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D (1) 14.1 13.9 E (1) 14.1 13.9 e 0.5 HD HE L 1 Lp 0.75 0.45 v 0.2 w 0.08 y 0.08 Z D (1) Z E (1) 1.15 0.85 1.15 0.85 7 o 0
o
16.25 16.25 15.75 15.75
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT407-1 REFERENCES IEC 136E20 JEDEC MS-026 JEITA EUROPEAN PROJECTION
ISSUE DATE 00-02-01 03-02-20
2005 Mar 09
24
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
14 SOLDERING 14.1 Introduction to soldering surface mount packages
SAA5360; SAA5361
To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 seconds and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 14.3 Wave soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 seconds to 5 seconds between 270 C and 320 C.
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.
2005 Mar 09
25
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
14.5
SAA5360; SAA5361
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable not suitable
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, VFBGA, XSON DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(5), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L(8), PMFP(9), WQCCN..L(8) Notes
not suitable not suitable(4) suitable not not recommended(5)(6) recommended(7)
not suitable
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar soldering or manual soldering is suitable for PMFP packages.
2005 Mar 09
26
Philips Semiconductors
Product specification
Multi page intelligent teletext decoder
15 DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development
SAA5360; SAA5361
DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 16 DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 17 DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2005 Mar 09
27
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2005
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R24/06/pp28
Date of release: 2005
Mar 09
Document order number:
9397 750 14857

▲Up To Search▲

Price & Availability of SAA5361

	To Download SAA5361 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .